Scientist (Cryogenic Advanced Packaging), SRTT -Q.InC | A*star Research Entities

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Scientist (Cryogenic Advanced Packaging), SRTT -Q.InC

2025-01-22

Singapore

Scientist (Cryogenic Advanced Packaging), SRTT -Q.InC

Butiran Pekerjaan

JobDescription:

As aScientist/Senior Scientist within Q.InC, you will join our team todevelop cutting-edge quantum packaging technology platforms. Theseplatforms will enable the low-noise, high density integration ofqubits and control chips on superconducting interposers. You willwork in a dynamic, interdisciplinary environment, collaboratingwith cross-functional teams to:

Design and develop 3D superconductinginterconnects.
Explore wafer-to-wafersuperconducting hybrid bonding techniques.
Establish design rules and Process Design Kits (PDKs) forquantum packaging technologies.
Preparecompetitive research grant proposals to advance the state of theart.
Partner with industry stakeholders tobuild foundational technologies for next-generation quantumpackagingplatforms.

JobResponsibilities:

Develop and optimize process flows based on quantumcomponent requirements, closely monitoring lot movements andensuring alignment with project milestones.
Collaborate with equipment and materials suppliers, aswell as end-users, to advance quantum packagingtechnologies.
Define and implement designrules and PDKs for superconducting qubit components.
Work with technical and business development teams toinitiate industry consortia projects with supply chainpartners.
Collaborate with other programs,A*STAR institutes, and academic institutions to prepare researchgrant proposals.

JobRequirements:

PhD inQuantum Computing, Electrical and Computer Engineering, MaterialsScience, or a related field with understanding of semiconductormaterial and manufacturing, chip integration or quantumtechnologies.
2 to 5 years of experience insemiconductor or quantum process development and integration, witha basic understanding of 3D quantum packaging.
Hands-on experience with process development,integration, and monitoring in semiconductor packaging.
Familiarity with 3D interconnect technologies, waferbonding, and other advanced packaging techniques.
Experience with quantum device fabrication and testing isa plus.
Knowledge of superconducting materialsand processes, such as hybrid bonding and superconductinginterposers.
Proven ability to develop andexecute innovative R&D projects, especially in emergingtechnologies.
Experience working withcross-functional teams, industry partners, andconsortia.
Excellent written and verbalcommunication skills for engaging with academic, industrial, andgovernmental stakeholders.
Self-motivated,proactive, and capable of effectively collaborating with diverseteams to achieve projectgoals.

The aboveeligibility criteria are not exhaustive. A*STAR may includeadditional selection criteria based on its prevailing recruitmentpolicies. These policies may be amended from time to time withoutnotice. We regret that only shortlisted candidates will benotified.

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